Capacitance Plasma etching CNTs’ collapse Thin film Functionalization AlN Aryl-diazonium salts Thin films Band gap Mott insulator Adsorption Nanotubes Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation SF 6 TiO2 A Multilayers Chalcogenide Buffer Couple Carbon Nanotube Amorphous Applications industrielles A3 Physical vapor deposition processes Bixbyite Rutile A1 Characterization Spectroscopic ellipsometry XPS Biomembranes Oxides Atomic force microscopy Non-volatile memory B2 Semiconducting indium compounds AuCu alloy Transfert d'énergie V2O3 Integrated optics B3 Solar cells X-ray photoelectron spectroscopy X-ray diffraction Physical vapor deposition Selenization B Chemical synthesis CH4 Alloying Mott insulators Sol-gel Biomasse Biofilms microbiens Scanning electron microscopy Vanadium Sesquioxide TEM Biocapteurs Alzheimer's disease Structure Films Ablation laser BOMBARDMENT Low-pressure plasma processing Residual stress Optical interferometry Calcined clay Annealing A Chalcogenides AZO thin films Titanium dioxide CIGSe Optical waveguides A-CNx B2 Quaternary Amyloid precursor NEXAFS Atomic layer etching Aluminium nitride Ambipolar material CaTiO3Pr^3^+ Optical properties Copper Kirkendall effect Magnetron sputtering C Photoelectron spectroscopy Anatase B2 Semiconducting alloys 3 nm in size Plasmas froids Resistive switching PECVD Bipolar resistive switching BRS Nanocomposite CHLORINE PLASMAS A Thin films Colloidal solution Avalanche breakdown Etching Transmission electron microscopy Sputtering Band alignment B1 Inorganic compounds Mass spectrometry Semiconductors Carbon